Thursday, September 07, 2006

Freescale's Power Management Chip Packs Powerful Punch for Mobile Devices; Single Chip Powers Voice Recording, Audio/Music Playback and Other Media Fe

Freescale Semiconductor (NYSE:FSL) (NYSE:FSL.B) is meeting the increasing demands to power new features in today's smart mobile devices with the introduction of the world's most highly integrated power management and user interface (PMUI) chip.

With this single-chip device, designers can optimize system power and drive a variety of powerful audio and multimedia features in products such as 3G phones, mobile gaming units and portable media players.

"Freescale's power management devices can reduce component count and board area by as much as 50% compared to many current implementations," said Mark Christensen, principal consultant at Prismark Partners. "This high level of integration is of particular importance in high-end 3G phones that must fit many features into a small form factor."

The MC13783 PMUI IC packs multiple systems into one device for unprecedented design freedom and part count reduction. Consolidated coordination of numerous system level modules simplifies design and helps to drive new levels of product sophistication at compelling price points.

The Freescale PMUI includes a full audio system, battery charger system, lighting system, five switching regulators, 18 linear regulators, USB transceiver, carkit interface, touchscreen interface and more. Additionally, the MC13783 gives OEMs a high degree of adaptability for feature scaling across tiered product families, accelerating products to market and cutting time to market and design costs.

"As the capabilities of mobile devices such as 3G handsets continue to expand, developers encounter more challenges with product size and battery life," said Franz Fink, senior vice president and general manager of Freescale's Wireless and Mobile Systems Group. "This device addresses both issues with an unmatched level of integration and power control. We're enabling OEMs to push the envelope of product sophistication, form factor and function."


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